Tell us a little bit about your company:

1. What is the primary general product or service provided by your organization?

a. Computer subcomponents

b. Communications subcomponents

c. Consumer electronics (non-computer) components

d. Medical equipment components

e. Military

f. R&D or Academic

g. Other

2. What is your job function?

a. Project management

b. Engineering (production)

c. Technical services

3. How many employees are at your company location?

a. 1-49

b. 50-99

c. 100-499

d. 500-999

e. 1000+

4. What is your company's total annual capital equipment expenditures?

a. Less than $1 million

b. $1 to $10 million

c. $10 to $50 million

d. greater than $50 million

Tell us why MBI is useful in your field:

5. Are you interested in MBI equipment or bonding services?

a. Equipment

b. Services

6. What are typical parts that you are interested in bonding?

a. MEMS structures

b. IC interconnects

c. Optical subcomponents

d. bio-medical devices

e. nano-devices

7. What are typical sample sizes?

a. Less than 1 cm x 1 cm

b. Between 1cm x 1cm and 3cm x 3cm

c. 4" diameter wafers

d. 6" diameter wafers

e. 8" to 12" diameter wafers

8. What is your typical qualification timeframe?

a. Less than 1 month

b. 1 to 3 months

c. 3 to 6 months

d. 6+ months

We're interested in giving the customer the most "bang for the buck" and by answering these questions, you'll tell us about how to best optimize our products.

On a scale of 1 to 5, with 1 being "I strongly disagree" to 5 being "I strongly agree", please rate each statement:

9. The ability to process samples in less than 30 seconds per sample is important.

10. The bonders should be scalable handle die to wafer size parts.

11. A manual bonder optimized for 1 device geometry, and selling for less than $25,000 will meet my needs.

12. A manual bonder that will accept processing upgrades to handle different device geometries, and selling for less than $100,000 will meet my needs.

13. I am only interested in automated, production, turn-key packaging tools.

14. A low cost device is important to me.

15. I need yields greater than 80% for this device to be useable in production.

16. Keeping the global substrate temperature below 150° C is important to me.

17. Processing odd sized samples is important to me.

18. Processing without applied pressure is important to me.

19. Processing in a vacuum is important to me.

20. Less than 5 micron bonding alignment tolerances are important to me.

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Additional Feedback and Comments:

Thank you for taking the time to answer the questions in our survey!
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