MBI is awarded a government grant to apply its technology to affect the diffusion of electronics contacts and improve the reliability of Infra Red (IR) detectors by microwave assembly technology.
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2006 |
MBI presents its technology to the heat dissipation community at the IMAP ATW in Palo Alto California as applied to the wafer level bonding of dissimilar substrates. The technology is applied to lighting, telecommunication, and power electronics devices.
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2005 |
MBI wins government grants to assemble Mercad (HgCdTe) IR detectors and study the assembly reliability
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2005 |
MBI wins government grant to assemble MEMS at the wafer level for high reliability applications (e.g. Harsh space environment.)
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2004 |
MBI wins an NSF grant for SOP (Systems on Package) assembly. |
2003 |
MBI is awarded a contract to develop high density interconnect bonding method for IR detectors.
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2002 |
MBI wins an SBIR grant to assembly a micro-klystron MEMS scale device.
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2001 |
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2001 |
| In the IEEE MEMS'99 Conference in Orlando Florida, the paper on the assembly of MEMS devices by microwaves was selected for oral presentation. Dr. Nasser Budraa, MBI Chief Technology Officer, and one of the inventors of this patented process, presented this technology to the MEMS community.
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1999 |
For more information, email info@microwavebonding.com |
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